Park Systems, the AFM technology leader and the preferred nanotechnology solutions partner, invite you to visit us at SEMICON WEST (Booth #1932), July 12th - 14th, 2011 at the Moscone Center in San Francisco, CA, USA. Park Systems, in its continuing efforts to provide our customers with metrology characterization solutions for today’s challenges in device manufacturing, will be featuring a range of automated AFM products for in-line inspection in wafer manufacturing. The capabilities of our featured systems range from critical dimension measurement to undercut and sidewall characterization. SEMICON West will provide an excellent opportunity to learn about the XE-Wafer, our automated industrial AFM for in-line wafer inspection and metrology of 200 mm and 300 mm wafers, and the XE-3DM, our new 3D AFM for high resolution 3D metrology with patented tilted Z-scan system. The XE-3DM is a breakthrough in high resolution imaging of deep undercut structures and sidewalls. In addition, our True Non-Contact ModeTM enables non-destructive measurement of soft photoresist surface with high aspect ratio tips. Come and discover Park Systems’ fully automated AFM solutions for process monitoring and characterization of critical topographies!