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  • NX10-AFM
    革新的研究に最短の道程 Park NX10
  • SmartScan-AFM
    簡単&パワフルシンプルな3ステップの操作 Park SmartScan
  • NX20-AFM
    不良解析や大型試料を用いた研究に付加価値の高い選択肢l Park NX20
  • NX-wafer-AFM
    インラインのウエハ検査とメトロロジーの為の全自動AFM Park NX-Wafer
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Innovation and Efficiency for 3D Metrology

Park Systems has introduced the revolutionary Park 3DM Series, the completely automated AFM system designed for overhang profiles, high-resolution sidewall imaging, and critical angle measurements. With the patented decoupled XY and Z scanning system with tilted Z-scanner, it overcomes the challenges of the normal and flare tip methods in accurate sidewall analysis. In utilizing our True Non-Contact Mode™, the Park 3DM Series enables non-destructive measurement of soft photoresist surfaces with high aspect ratio tips.

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Park NX-3DM

Park NX-3DM


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A fully automated industrial AFM using NX technology

  • Clean room compatible and fully automated for measurement and data analysis at the nanoscale level
  • NX technology automatically constructs an extremely accurate topographical image and collects essential dimensional data
  • The Industry leading,low noise Z-detector works on an independent, closed loop to minimize errors in topography (the “creep effect”)
  • True Non-contact™ mode allow for the collection of high resolution and accurate data without tip-sample damage, something that could otherwise cost you valuable time and money

Innovative head design for undercut and overhang structures

  • Z-head’s unique sideways orientation allows access to the undercut and overhang structures of photoresist and other industrial material
  • Patented decoupled XY and Z scanning systems work together with the tilted Z-scanner, letting users overcome normal challenges in accurate sidewall analysis associated with normal and flare tip methods
  • Sidewall trench line profile, roughness, critical angle and critical dimension can all be measured using the NX-3DM
  • Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to obtain the same high resolution and definition as is obtained over the rest of the material

A Reliable, Seamless Measurement Tool for 3D materials

  • No sample preparation (eg. cutting, mounting or coating) is required to obtain the sidewall roughness or critical dimension measurements in this process
  • By utilizing Z-head tilting and True Non-contact™ mode, the NX-3DM allows for both tip-preserving and high resolution collection of sidewall data
 

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